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Cutting-edge application fields

  Submicron spherical silicon powder is very suitable for reducing the viscosity of various resins and paints,improving flowability,reducing burrs,and other purposes.It is widely used as an additive for promoting the flowability and reducing burrs of various resins used in semiconductor packaging,carbon powder additives,silicone rubber fillers,sintering materials and additives,fillers for liquid packaging materials,various resin fillers,resin substrates,and narrow gap applications.
  Because of its high flow and high thermal conductivity,spherical aluminum oxide powder can be used as filler for semiconductor packaging,as well as as the base powder for ceramic powder firing,as well as polishing fluid and Thermal spraying materials.

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